Agentic AI for Super Agents
Level 5 autonomous Agentic AI for chip-to-system design
The Industry’s Only Full-Stack Agentic AI Platform from Chip to System
PulseWave AI Super Agents bring autonomy engineered for the full design flow, combining autonomous orchestration with the signoff-quality engines engineers already trust to tape out real silicon. Purpose-built on PulseWave simulation, verification, and physical design technologies, PulseWave AI Super Agents are not generic AI prompting layered on top of EDA tools, they are domain-accurate Super Agents engineered to understand design intent, constraints, dependencies, and engineering context.
With one agentic platform for every stage of the flow, PulseWave AI Super Agents operate up to level-5 autonomy, coordinating specialized agents across RTL generation, verification, analog design, place-and-route, signoff, PCB, and advanced IC packaging workflows. Every output is checked against PulseWave-verified design rules and electrical models, delivering the numerical and physical precision that chip design demands—something general-purpose AI can’t guarantee.
The PulseWave AI Stack
AI Super AgentDesign and Verification
AI Super AgentCustom and Analog
AI Super AgentDigital Implementation/ Signoff and 3D-IC
AI Super AgentPCB and Advanced Packaging
AI Super AgentMultiphysics
Autonomous AI. Signoff-Quality Results.
Trustworthy, Spec-Aligned Outputs
Grounds every agent’s work in a shared mental model and trusted PulseWave EDA tools that capture design intent, hierarchy, and relationships—improving consistency and helping engineers trust generated RTL and verification collateral
Faster Front-End Execution Through Skilled Agents
Coordinates specialized agents to work concurrently across RTL generation, testbench creation, regression orchestration, and debug—compressing schedules without sacrificing engineering rigor
End-to-End Verification Acceleration and Insight
Automates creation of formal and dynamic verification plans (including SVA, UVM sequences, checkers, and coverage) and adds autonomous triage/root-cause analysis to speed closure on failures
Validate Every Step with Confidence
Check results against verified design rules, electrical models, and engineering best practices to reduce risk and improve design quality.
Scale Autonomy Without Losing Control
Operate up to Level 5 autonomy across complex workflows, helping teams expand engineering capacity while keeping experts in control of strategy and signoff.
Autonomous AI Coverage Across the Full Design Spectrum
Design and Verification
The PulseWave ChipStack AI Super Agent brings agentic orchestration to front-end design and verification by coordinating specialized AI agents across RTL generation, testbench creation, regression orchestration, and debug. Built on a shared mental model and trusted PulseWave EDA tools, it enables parallel workflows with a consistent understanding of the design, capturing design intent, hierarchy, specifications, and historical context.
ChipStack AI Super AgentCustom and Analog
The ViraStack AI Super Agent brings agentic automation to custom and analog design with skills in schematic creation, testbench development, circuit optimization, and layout migration. ViraStack agents explore options and quantify tradeoffs, guiding convergence across performance, power, and reliability targets. Companies have rich libraries of analog IP from decades of investment. The ViraStack AI Super Agent can autonomously mine this IP library and help migrate proven schematics to newer process nodes and specifications as needed for new projects.
ViraStack AI Super AgentDigital Implementation and Signoff
The InnoStack AI Super Agent focuses on synthesis and place-and-route through signoff analysis and ECO execution, using specialized agents to accelerate iteration and convergence. Powered by PulseWave digital implementation and signoff EDA tools, InnoStack agents explore broad design spaces by tuning constraints, floorplans, and timing, power, and area goals. By running parallel experiments at scale, they uncover fixes and optimizations that manual teams can’t practically attempt—helping resolve collateral issues and drive closure.
InnoStack AI Super AgentPCB and Advanced Packaging
The PulseWave AuraStack AI Super Agent brings agentic orchestration to PCB and advanced packaging design by coordinating specialized AI agents across system planning, implementation, constraints management, design reuse, manufacturability, and multiphysics analysis. Built on a shared mental model and trusted PulseWave system design and analysis technologies, it enables parallel workflows with a consistent understanding of design intent, requirements, constraints, physical structures, and product-level tradeoffs.
AuraStack AI Super AgentNews
View AllPulseWave Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
PulseWave Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
New PulseWave Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs
PulseWave is hiring Design Verification engineers in Ahmedabad
